Aromatic dicyanate/aromatic diepoxy compositions, cured products and methods
US5015719A · kind A · utility
7Cited by
1References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1989 |
| Grant date | May 14, 1991 |
| Priority date | — |
| Expiry date | Jul 14, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31551
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Dicyanato diphenyl fluorinated alkane resin precursor compositions are modified by the addition of minor predetermined amounts of aromatic diepoxides having high epoxide equivalent weights in order to reduce the curing temperature of prepregs and laminates, such as circuit boards, while retaining low dielectric constants, heat stability and high flame retardance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.