Kostas Papathomas
59Patents
19h-index
59Co-inventors
87Inventor score
Filing activity: Jul 14, 1989 → Oct 4, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5822856A | Manufacturing circuit board assemblies having filled vias | Emerging Cross-Sectional Technologies | 174 | Expired |
| US4999699A | Solder interconnection structure and process for making | Emerging Cross-Sectional Technologies | 106 | Expired |
| US6323436A | High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer | Electricity | 105 | Expired |
| US5194930A | Dielectric composition and solder interconnection structure for its use | Electricity | 103 | Expired |
| US6178093A | Information handling system with circuit assembly having holes filled with filler material | Emerging Cross-Sectional Technologies | 83 | Expired |
| US5268260A | Photoresist develop and strip solvent compositions and method for their use | Physics | 80 | Expired |
| US5668059A | Solder interconnection structure and process for making | Emerging Cross-Sectional Technologies | 56 | Expired |
| US5089440A | Solder interconnection structure and process for making | Emerging Cross-Sectional Technologies | 56 | Expired |
| US5656862A | Solder interconnection structure | Emerging Cross-Sectional Technologies | 55 | Expired |
| US7508076B2 | Information handling system including a circuitized substrate having a dielectric layer without continuous fibers | Electricity | 53 | Expired |
| US5250848A | Solder interconnection structure | Emerging Cross-Sectional Technologies | 49 | Expired |
| US5571593A | Via fill compositions for direct attach of devices and methods for applying same | Emerging Cross-Sectional Technologies | 38 | Expired |
| US6079100A | Method of making a printed circuit board having filled holes and fill member for use therewith | Emerging Cross-Sectional Technologies | 31 | Expired |
| US6207595A | Laminate and method of manufacture thereof | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6000129A | Process for manufacturing a circuit with filled holes | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5766670A | Via fill compositions for direct attach of devices and methods for applying same | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5542602A | Stabilization of conductive adhesive by metallurgical bonding | Electricity | 26 | Expired |
| US6138350A | Process for manufacturing a circuit board with filled holes | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6106891A | Via fill compositions for direct attach of devices and method for applying same | Emerging Cross-Sectional Technologies | 22 | Expired |
| US5713508A | Stabilization of conductive adhesive by metallurgical bonding | Electricity | 17 | Expired |
| US6555762B2 | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6199751A | Polymer with transient liquid phase bondable particles | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6066889A | Methods of selectively filling apertures | Electricity | 16 | Expired |
| US6127025A | Circuit board with wiring sealing filled holes | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6127097A | Photoresist develop and strip solvent compositions and method for their use | Physics | 15 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.