Thermal performance package for integrated circuit chip
US5015803A · kind A · utility
38Cited by
37References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 1989 |
| Grant date | May 14, 1991 |
| Priority date | — |
| Expiry date | May 31, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1275
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Composite materials for electronic packages are disclosed. The composite materials comprise a core layer and first and second cladding layers. The core and cladding layer compositions and thicknesses are selected to maximize thermal and electrical conductivity and to minimize the coefficient of thermal expansion of the composite. The composite material may be employed to fashion the package base, the leadframe, a heat spreader or combinations thereof. In one embodiment, a portion of the first cladding layer is removed so that an electronic device may be mounted directly to a high thermal conductivity core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.