Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment
US5019210A · kind A · utility
28Cited by
12References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1989 |
| Grant date | May 28, 1991 |
| Priority date | — |
| Expiry date | Apr 3, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method for water vapor plasma treating the surface of a polymer body to enhance the adhesion of a first and second polymer surface. The method is particularly useful for polyimide surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.