Steven E. Molis
16Patents
9h-index
56Co-inventors
75Inventor score
Filing activity: Jul 13, 1988 → Feb 25, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5019210A | Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment | Emerging Cross-Sectional Technologies | 28 | Expired |
| US5591285A | Fluorinated carbon polymer composites | Emerging Cross-Sectional Technologies | 27 | Expired |
| US8420531B2 | Enhanced diffusion barrier for interconnect structures | Electricity | 26 | Active |
| US5397863A | Fluorinated carbon polymer composites | Emerging Cross-Sectional Technologies | 25 | Expired |
| US6149840A | Electrically conductive polymeric materials and use thereof | Chemistry; Metallurgy | 23 | Expired |
| US5556899A | Fluorinated carbon polymer composites | Emerging Cross-Sectional Technologies | 22 | Expired |
| US4846929A | Wet etching of thermally or chemically cured polyimide | Electricity | 17 | Expired |
| US5571852A | Fluorinated carbon polymer composites | Emerging Cross-Sectional Technologies | 15 | Expired |
| US7838428B2 | Method of repairing process induced dielectric damage by the use of GCIB surface treatment using gas clusters of organic molecular species | Electricity | 12 | Active |
| US8742581B2 | Enhanced diffusion barrier for interconnect structures | Electricity | 9 | Active |
| US6168732A | Electrically conductive polymeric materials and use thereof | Chemistry; Metallurgy | 4 | Expired |
| US7615482B2 | Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength | Emerging Cross-Sectional Technologies | 4 | Active |
| US9040390B2 | Releasable buried layer for 3-D fabrication and methods of manufacturing | Emerging Cross-Sectional Technologies | 1 | Active |
| US7585431B1 | Electrically conductive polymeric materials and use thereof | Chemistry; Metallurgy | 1 | Expired |
| US7932342B2 | Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system | Chemistry; Metallurgy | 0 | Active |
| US7737029B2 | Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.