Shock wave particle removal method and apparatus
US5023424A · kind A · utility
57Cited by
11References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 22, 1990 |
| Grant date | Jun 11, 1991 |
| Priority date | — |
| Expiry date | Jan 22, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K7/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method using laser induced shock waves to dislodge particles from a wafer surface. The apparatus includes a wafer support, a particle detector and computer for locating and storing the locations of particles on the wafer, a laser, and focusing optics. Laser beam pulses are directed toward the wafer surface at a shallow angle or with a large beam convergence angle to avoid damage to the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.