Device for coating a substrate

US5026471A · kind A · utility

Assignee

• Leybold GmBH · DE

Inventors

• Rudolf Latz · Rodgau, DE
• Michael Scherer · Crimmitschau, DE

Key dates

• Filing date: Nov 29, 1989
• Grant date: Jun 25, 1991
• Expiry date: Nov 29, 2009

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/3408
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

A device for coating a substrate 1 with electrically conductive materials 2 includes a direct current and/or alternating current source 10, 38 which is connected to an electrode 44 disposed in an evacuable coating chamber 15, 15a, 15b and electrically connected to a target 43 which is to be sputtered and the sputtered particles of which are deposited on the substrate a process gas can be introduced into the coating chamber 15, 15a, 15b and wherein toroidal magnetic fields penetrate the target and the magnetic flux lines thereof exit from the surface of the target in the area of the magnetic poles 45, 46, 47. The target 43 has essentially an oval layout enclosed by a dark space shield 34 having circumferential front 35 which faces the substrate 1 and is slightly set back behind the front of the target 34. The magnet arrangement which is disposed in a cathode trough 4 and supported on a yoke 48 includes a center row of small magnets 46 extending in longitudinal direction of the target, a further continuous row of small magnets 45, 47 disposed at the edge of the yoke and two round magnets each of which is at the respective end of the center row of magnets 46.