Electroless plating of portions of semiconductor devices and the like
US5028454A · kind A · utility
16Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 1989 |
| Grant date | Jul 2, 1991 |
| Priority date | — |
| Expiry date | Oct 16, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for electrolessly plating portions of semiconductor devices and the like comprises the steps of providing a first metal having a higher electromotive series than a coating metal, galvanically coupling a second metal to the first metal wherein a portion of the first metal remains exposed and then subjecting the second metal and the exposed portion of the first metal to an electroless coating metal plating solution. The method employs no masks and is ideal for plating small areas such as single ball bonds and limited numbers of ball bonds on a single semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.