Inventor · Chandler, AZ, US

William H. Lytle

28Patents
14h-index
39Co-inventors
81Inventor score

Filing activity: Aug 28, 1987 → Aug 29, 2014

Most-cited inventions

PatentTitleAreaCited byStatus
US5391285A Adjustable plating cell for uniform bump plating of semiconductor wafers Electricity 116 Expired
US5593903A Method of forming contact pads for wafer level testing and burn-in of semiconductor dice Electricity 77 Expired
US6953985B2 Wafer level MEMS packaging Electricity 76 Expired
US5587342A Method of forming an electrical interconnect Electricity 63 Expired
US7595226B2 Method of packaging an integrated circuit die Electricity 59 Active
US5912510A Bonding structure for an electronic device Electricity 57 Expired
US7442581B2 Flexible carrier and release method for high volume electronic package fabrication Electricity 47 Expired
US4787958A Method of chemically etching TiW and/or TiWN Emerging Cross-Sectional Technologies 38 Expired
US7741151B2 Integrated circuit package formation Electricity 36 Active
US5411400A Interconnect system for a semiconductor chip and a substrate Electricity 35 Expired
US6974776B2 Activation plate for electroless and immersion plating of integrated circuits Electricity 32 Expired
US5674780A Method of forming an electrically conductive polymer bump over an aluminum electrode Electricity 30 Expired
US7078796B2 Corrosion-resistant copper bond pad and integrated device Electricity 24 Expired
US5028454A Electroless plating of portions of semiconductor devices and the like Electricity 16 Expired
US7838420B2 Method for forming a packaged semiconductor device Electricity 11 Active
US8829661B2 Warp compensated package and method Electricity 10 Active
US5072873A Device for solder removal Electricity 10 Expired
US5409567A Method of etching copper layers Electricity 8 Expired
US8327532B2 Method for releasing a microelectronic assembly from a carrier substrate Emerging Cross-Sectional Technologies 7 Active
US4946376A Backside metallization scheme for semiconductor devices Emerging Cross-Sectional Technologies 7 Expired
US7969026B2 Flexible carrier for high volume electronic package fabrication Electricity 6 Active
US9107303B2 Warp compensated electronic assemblies Electricity 5 Active
US6949398B2 Low cost fabrication and assembly of lid for semiconductor devices Electricity 3 Expired
US9142434B2 Method for singulating electronic components from a substrate Electricity 2 Active
US8415203B2 Method of forming a semiconductor package including two devices Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.