TAB tape translator for use with semiconductor devices
US5029325A · kind A · utility
36Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1990 |
| Grant date | Jul 2, 1991 |
| Priority date | — |
| Expiry date | Aug 31, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first plurality of contacts are disposed on a first surface of a flexible tape in a pattern matching the pattern of the contacts of a semiconductor die. A second plurality of contacts are disposed on a second surface of the flexible tape in a pattern matching the pattern of the contacts of a substrate. The first and second plurality of contacts are then coupled by conductive lines disposed on the surfaces of the flexible tape and extending through the conductive tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.