Method and apparatus for slicing crystalline wafers aided by magnetic field monitoring means

US5030910A · kind A · utility

Assignee

• Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

• Joachim Junge · Burghausen, DE
• Johann Glas · Burghausen, DE
• Johann Niedermeier · Burghausen, DE
• Gerhard Brehm · Emmerting, DE

Key dates

• Filing date: Jul 24, 1989
• Grant date: Jul 9, 1991
• Expiry date: Jul 24, 2009

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T83/141
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

In a method and apparatus for monitoring the path of the cut in slicing wrs from non-magnetizble crystalline workpieces with a slicing tool which is moved through the workpiece, a measuring unit is disposed in a defined position with respect to the slicing tool and a constant magnetic field is established between the measuring unit and the slicing tool. The magnetic field during the slicing process passes at least partly through the wafer to be sliced off and varies with deviations of the slicing tool from the required line of cut established between the fixed measuring unit and the slicing tool. By measuring the change in the constant field caused by the deviation of the slicing tool, the slicing tool can be brought back into the required direction again by regulation so that wafers with excellent planarity are obtained.