Thin semiconductor card
US5031026A · kind A · utility
62Cited by
5References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 1, 1988 |
| Grant date | Jul 9, 1991 |
| Priority date | — |
| Expiry date | Jul 1, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/077
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The reliability of a thin semiconductor card, such as an IC card, is enhanced by stress absorbing part such as deformable part for absorbing externally applied stress, thereby preventing the stress from damaging the card main body, the semiconductor module, or the semiconductor elements. Alternatively, protection is provided by a weaker section, located away from the semiconductor module, that breaks under external stress before the stress can destroy the semiconductor module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.