Copper device and use thereof with semiconductor devices
US5031029A · kind A · utility
18Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1990 |
| Grant date | Jul 9, 1991 |
| Priority date | — |
| Expiry date | Apr 4, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/905
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device that contains a copper substrate; a rigidizing layer and/or a metal layer, and a non-graphitic hard carbon layer deposited on the rigidizing layer; and use as a heat sink or piston for electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.