Workpiece carrier for a disk-shaped workpiece as well as a vacuum process space
US5033538A · kind A · utility
62Cited by
9References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 1990 |
| Grant date | Jul 23, 1991 |
| Priority date | — |
| Expiry date | May 7, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
For the transmission of heat under vacuum conditions to a workpiece, a carrier is used with gas outlets and gas return openings distributed on its surface. A dynamic gas layer is thus formed between the carrier and the workpiece wherein the gas effects thermal conduction between the carrier and the workpiece. The gas outlets terminate in a distribution space implemented as a groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.