Multilayer interconnection circuit board
US5034569A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 1990 |
| Grant date | Jul 23, 1991 |
| Priority date | — |
| Expiry date | Apr 5, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer interconnection circuit board includes insulating layers and conductor wiring layers which are alternately laminated. The uppermost conductor wiring layer is electrically connected to an intermediate conductor wiring layer to a predetermined stage by irradiating laser beams in the direction of lamination of layers so that the conductor wiring layer or layers located above the intermediate conductor wiring layer are successively molten by the laser beams. The surface irradiated by the laser beams of the conductor wiring layer at the predetermined stage is treated to reflect laser energy, and the surface of the conductor wiring layer or layers which are molten by the laser beams is treated so as to be susceptive to absorb the laser beams.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.