Planarizing dielectric

US5037876A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Siegfried Birkle · Höchstadt an der Aisch, DE
• Albert Hammerschmidt · Erlangen, DE
• Johann Kammermaier · Unterhaching, DE
• Rainer Leuschner · Regensburg, DE
• Rolf Schulte

Key dates

• Filing date: Apr 5, 1990
• Grant date: Aug 6, 1991
• Expiry date: Apr 5, 2010

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A planarizing dielectric, which is particularly suitable for electronic components, fulfills the required properties to a high degree when it comprises a matrix of a high-temperature resistant, organic polymer, into which matrix is intercalated in fine distribution a solid filler material, which is etchable in oxygen plasma, has high thermal conductivity and good dielectric properties.