Inventor · Regensburg, DE

Rainer Leuschner

76Patents
17h-index
111Co-inventors
87Inventor score

Filing activity: Mar 10, 1988 → Apr 21, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US5234793A Method for dimensionally accurate structure transfer in bilayer technique wherein a treating step with a bulging agent is employed after development Physics 86 Expired
US6704230B1 Error detection and correction method and apparatus in a magnetoresistive random access memory Physics 69 Expired
US5173393A Etch-resistant deep ultraviolet resist process having an aromatic treating step after development Physics 64 Expired
US7092284B2 MRAM with magnetic via for storage of information and field sensor Physics 50 Expired
US9593009B2 Apparatus comprising and a method for manufacturing an embedded MEMS device Electricity 42 Active
US5250375A Photostructuring process Physics 39 Expired
US8183696B2 Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads Electricity 38 Active
US6704220B2 Layout for thermally selected cross-point MRAM cell Physics 34 Expired
US5234794A Photostructuring method Physics 28 Expired
US7643332B2 MRAM cell using multiple axes magnetization and method of operation Electricity 28 Active
US7697322B2 Integrated circuits; method for manufacturing an integrated circuit; method for decreasing the influence of magnetic fields; memory module Electricity 27 Active
US5037876A Planarizing dielectric Electricity 26 Expired
US6582888B1 Method for producing organic electroluminescent components Electricity 25 Expired
US7660151B2 Method for programming an integrated circuit, method for programming a plurality of cells, integrated circuit, cell arrangement Physics 22 Active
US8665629B2 Condensed memory cell structure using a FinFET Electricity 21 Active
US7855435B2 Integrated circuit, method of manufacturing an integrated circuit, and memory module Physics 20 Active
US5556812A Connection and build-up technique for multichip modules Electricity 19 Expired
US8741690B2 Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads Electricity 16 Active
US6815248B2 Material combinations for tunnel junction cap layer, tunnel junction hard mask and tunnel junction stack seed layer in MRAM processing Electricity 15 Expired
US6042993A Photolithographic structure generation process Emerging Cross-Sectional Technologies 15 Expired
US5384220A Production of photolithographic structures Emerging Cross-Sectional Technologies 13 Expired
US6171755A Chemically amplified resist Emerging Cross-Sectional Technologies 13 Expired
US6503655B1 Gas diffusion electrode and its production Emerging Cross-Sectional Technologies 12 Expired
US6576358B2 Method of discharging reaction water in PEM fuel cells and fuel cell for carrying out the method Emerging Cross-Sectional Technologies 11 Expired
US9884757B2 MEMS sensor package systems and methods Electricity 10 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.