Bonding of metallic surfaces
US5038996A · kind A · utility
46Cited by
17References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 1989 |
| Grant date | Aug 13, 1991 |
| Priority date | — |
| Expiry date | Jul 17, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01327
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Two metallic surfaces are bonded together by coating each of the metallic surfaces with a layer of a first material and a layer of a second and different material contacting the layer of the first material. The first material and second material are chosen so that a eutectic liquid layer will form at the interface between them. The layers of the second material on each of the metallic surfaces are abutted together and then the layers are heated above the eutectic temperatures to form a localized liquid, which upon solidification results in an interconnection between the surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.