James R. Wilcox
36Patents
15h-index
46Co-inventors
81Inventor score
Filing activity: Jul 17, 1989 → Sep 18, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5874776A | Thermal stress relieving substrate | Electricity | 78 | Expired |
| US6104093A | Thermally enhanced and mechanically balanced flip chip package and method of forming | Electricity | 61 | Expired |
| US6373717B1 | Electronic package with high density interconnect layer | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5981312A | Method for injection molded flip chip encapsulation | Electricity | 47 | Expired |
| US5038996A | Bonding of metallic surfaces | Electricity | 46 | Expired |
| US5949246A | Test head for applying signals in a burn-in test of an integrated circuit | Physics | 46 | Expired |
| US6351393B1 | Electronic package for electronic components and method of making same | Emerging Cross-Sectional Technologies | 37 | Expired |
| US5847324A | High performance electrical cable | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6094060A | Test head for applying signals in a burn-in test of an integrated circuit | Physics | 32 | Expired |
| US6094059A | Apparatus and method for burn-in/testing of integrated circuit devices | Physics | 31 | Expired |
| US5736679A | Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board | Emerging Cross-Sectional Technologies | 29 | Expired |
| US6410988B1 | Thermally enhanced and mechanically balanced flip chip package and method of forming | Electricity | 22 | Expired |
| US5781413A | Method and apparatus for directing the input/output connection of integrated circuit chip cube configurations | Electricity | 16 | Expired |
| US5977642A | Dendrite interconnect for planarization and method for producing same | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5659951A | Method for making printed circuit board with flush surface lands | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6369449B2 | Method and apparatus for injection molded flip chip encapsulation | Electricity | 14 | Expired |
| US6829823B2 | Method of making a multi-layered interconnect structure | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5359767A | Method of making multilayered circuit board | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5403420A | Fabrication tool and method for parallel processor structure and package | Emerging Cross-Sectional Technologies | 11 | Expired |
| US5442144A | Multilayered circuit board | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6249045A | Tented plated through-holes and method for fabrication thereof | Electricity | 6 | Expired |
| US7137826B2 | Temperature dependent semiconductor module connectors | Electricity | 5 | Expired |
| US6570261B2 | Method and apparatus for injection molded flip chip encapsulation | Electricity | 4 | Expired |
| US6427323B2 | Method for producing conductor interconnect with dendrites | Emerging Cross-Sectional Technologies | 4 | Expired |
| US5942127A | Fuel oil treatment unit and associated method | Performing Operations; Transporting | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.