Polyimide resin compositions
US5041513A · kind A · utility
9Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 1990 |
| Grant date | Aug 20, 1991 |
| Priority date | — |
| Expiry date | May 31, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/306
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimide resin is prepared by polymerizing (A) a tetracarboxylic acid dianhydride component consisting essentially of 10 to 50 mol % of 2,2-bis(3,4-benzene-dicarboxylic anhydride)perfluoropropane and 90 to 50 mol % of pyromelitic dianhydride or similar acid dianhydride and (B) a diamine component consisting essentially of 10 to 80 mol % of a silicon diamine and 90 to 20 mol % of an ether diamine. The polyimide resin is soluble in ordinary organic solvents to form solutions which are readily applicable to substrates, typically providing insulating protective coatings on electronic parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.