Composition comprising epoxy resin, bismaleimide and barbituric acid
US5041519A · kind A · utility
9Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1988 |
| Grant date | Aug 20, 1991 |
| Priority date | — |
| Expiry date | Dec 8, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to a resin composition which is used for the production of printed circuit boards. The feature of said resin composition is to add barbituric acid or its derivatives to a bismaleimide resin, and mixed in a solvent or solvent system. The mixture is then added with epoxy resin and suitable amount of curing agent to form the required resin composition. The resin composition has high glass transition temperature and good toughness and other physical and electrical properties. Meanwhile, it would not cause phase separation, so is a high-performance material for the production of printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.