Lead frame and semiconductor device using the same
US5041901A · kind A · utility
54Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 1990 |
| Grant date | Aug 20, 1991 |
| Priority date | — |
| Expiry date | May 2, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame having a plurality of inner leads and outer leads, said outer leads being subjected to surface treatment for improving solder wettability at an end portion and to sruface treatment for suppressing solder wettability at least at a portion neighboring to the end portion, or said outer leads being bent 4 times or more, is effective for improving thermal fatigue life and reliability when applied to a semi-conductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.