Solder placement nozzle assembly
US5042708A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1990 |
| Grant date | Aug 27, 1991 |
| Priority date | — |
| Expiry date | Sep 24, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes an upper nozzle mount and a removeable nozzle head which has an interior bore for receiving a portion of the nozzle mount and an elongate heat source. The nozzle head also includes an orifice for receiving solid solder fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the interior bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.