Metal electronic package having improved resistance to electromagnetic interference
US5043534A · kind A · utility
60Cited by
27References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1990 |
| Grant date | Aug 27, 1991 |
| Priority date | — |
| Expiry date | Jul 2, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metal electronic package is provided having improved electromagnetic interference shielding. Metal base and cover components are electrically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrically conductive conduit, such as a contact pin, provides interconnection. If the electronic device is mounted on a chip pad attach, the conductive conduit also connects to the support pads of the chip attach.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.