Method for manufacturing metal core printed circuit boards
US5044074A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 1990 |
| Grant date | Sep 3, 1991 |
| Priority date | — |
| Expiry date | Mar 16, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for the manufacturing of a metal core pc board which provides for manufacturing of two or three dimensional metal core pc boards of any form. The manufacturing of such pc boards can occur by injection molding, injection/compression methods or by a pressing method. High-heat resistant thermoplastics, as well as thermoset plastics are preferably used as pc board materials. A metal with good thermal conductibility is used for the core. The material is selected such that the thermal expansion coefficients of the metal core and the pc board material are optimally equal. The manufacturing contains the following steps: lamination of the metal plate with a plastic foil on one or both sides; placing of such prepared metal core in an injection molding tool; and thermoforming the plastic on the laminated core over the plastic foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.