Pad array carrier IC device using flexible tape
US5045921A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 1989 |
| Grant date | Sep 3, 1991 |
| Priority date | — |
| Expiry date | Dec 26, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic pad array carrier IC device for mounting on a printed circuit board (PCB) or flex circuit substrate has a thin, flexible "tape" substrate having a plurality of traces. The substrate may be a polyimide or other material that can withstand relatively large lateral mechanical displacement. An integrated circuit die is mounted in proximity with or on the substrate and electrical connections between the integrated circuit chip and the traces are made by any conventional means. The substrate traces are provided at their outer ends with solder balls or pads for making connections to the PCB. A package body covers the die, which body may be optionally used to stand off the package a set distance from the PCB so that the solder balls will form the proper concave structure. Alternatively, a carrier structure may be provided around the periphery of the substrate to add rigidity during handling, testing and mounting, but which may also provide the stand-off function. The thin, flexible substrate can absorb a relatively large lateral or even vertical mechanical displacement over a rather large package area that may accommodate as few as 20 or as many 500 or more connections. The s…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.