Method of manufacturing a multilayer circuit board
US5046238A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1990 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | Mar 15, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31544
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers comprised of a dielectric substrate having a circuit formed thereon are stacked, one on top of the other. The dielectric substrate is composed of a polymeric material capable of undergoing fusion bonding such as a fluoropolymeric based substrate. Fusible conductive bonding material (e.g. solder) is applied on selected exposed circuit traces (prior to the stacking step) whereupon the entire stack-up is subjected to lamination under heat and pressure to simultaneously fuse all of the substrate and conductive layers together to form an integral multilayer circuit having solid conductive interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.