Apparatus for rapid non-destructive measurement of die attach quality in packaged integrated circuits
US5046363A · kind A · utility
13Cited by
0References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 13, 1989 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | Oct 13, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/0235
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus is disclosed for the non-destructive measurement of die-attach quality in packaged integrated circuit. The apparatus is used in a production line and uses acoustical pulses to generate signals from within the integrated circuit indicative of the die-attach quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.