Method for selectively curing a film on a substrate
US5047611A · kind A · utility
11Cited by
7References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 23, 1990 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | Mar 23, 2010 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27B17/0025
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method for rapidly curing a film on a substrate by selective heating, causing it to cure from the inside out. This is accomplished by illuminating the sample with a light source having a peak wavelength which will be primarily absorbed by the underlying substrate and is transparent to the overlying film. Thus the substrate will be selectively heated first by direct absorption of the radiation, and the film to be cured will in turn be heated by conduction from the substrate. In this way, the film will be cured from the interior interface to the surface, or from the inside-out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.