Semiconductor device with heat transfer cap
US5047837A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1989 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | Aug 3, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor device having heat transfer leads carrying a semiconductor chip directly or indirectly through a chip pad and extended to the exterior of the plastic or ceramics seal of the package, and a heat transfer cap held in surface contact with the extended heat transfer leads and covering upper side of the package. The heat generated in the semiconductor chip is transmitted to the upper side of the package and to the printed circuit board only through metallic parts so that the heat transfer is enhanced to remarkably reduce thermal resistance, thus enabling packaging of a semiconductor chip having a large heat generation rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.