Article comprising a stacked array of electronic subassemblies
US5049982A · kind A · utility
46Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 1990 |
| Grant date | Sep 17, 1991 |
| Priority date | — |
| Expiry date | May 10, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is an article comprising a stacked array of electronic subassemblies, each subassembly including one or more integrated circuits and a thermally conductive base member that is perforated with holes. Motivating means are provided for causing a coolant fluid to pass through the holes in a direction substantially parallel to the stacking axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.