Patent · US Expired

Apparatus and method for detecting vertically propagated defects in integrated circuits

US5051690A · kind A · utility

39Cited by
5References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 26, 1989
Grant dateSep 24, 1991
Priority date
Expiry dateMay 26, 2009

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R31/2853
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Vertically propagated defects in integrated circuits are detected utilizing an apparatus which includes a first meander structure formed on or in a substrate and a second meander structure electrically insulated from the first meander. Each meander includes intermediate segments, the ends of which are interconnected by folded segments. A first set metal of strips are electrically insulated from the first and second meanders. The ends of each strip in the first set are electrically connected to the ends of a corresponding intermediate segment of the first meander. A second set metal or strips are electrically insulated from the first set of strips, the first meander and the second meander. The ends of each strip in the second set are electrically connected to the ends of a corresponding intermediate segment of the second meander and at least a portion of the second set of strips overlies at least a portion of the first set of strips.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.