Bonding amalgam and method of making
US5053195A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 19, 1989 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Jul 19, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3457
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An amalgam and a method of preparing an amalgam for bonding two articles together, which includes mixing a composition of a liquid metal and a metal powder to thoroughly wet the metal powder with the liquid metal, and thereafter mixing a composition with a pestle element for mechanically amalgamating the composition. Other additives may be provided such as ductile metals, additives containing oxides, ceramics, or other non-metallic compounds, and volatile constituents. The amalgamated composition can then wet surfaces to be bonded and harden at or near room temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.