Patent · US Expired

Bonding amalgam and method of making

US5053195A · kind A · utility

47Cited by
12References
13Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJul 19, 1989
Grant dateOct 1, 1991
Priority date
Expiry dateJul 19, 2009

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K3/3457
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

An amalgam and a method of preparing an amalgam for bonding two articles together, which includes mixing a composition of a liquid metal and a metal powder to thoroughly wet the metal powder with the liquid metal, and thereafter mixing a composition with a pestle element for mechanically amalgamating the composition. Other additives may be provided such as ductile metals, additives containing oxides, ceramics, or other non-metallic compounds, and volatile constituents. The amalgamated composition can then wet surfaces to be bonded and harden at or near room temperature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.