Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 PPM or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent
US5053280A · kind A · utility
6Cited by
16References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 1989 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Sep 18, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive composition for producing printed wiring boards comprising (A) acrylonitrile-butadiene rubber having carboxyl groups in the molecule and containing 20 ppm or less of metal ionic impurities, (B) an alkyl phenol resin, (C) an epoxy resin, (D) a catalyst for electroless plating, and (E) a coupling agent having an ethylene or vinyl group, is useful in a so-called additive process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.