Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices
US5053856A · kind A · utility
21Cited by
4References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 4, 1990 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Sep 4, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An arrangement for packaging thin planar arrays of circuit components including a plurality of essentially thin parallel layers in which the layers lie closely adjacent one another, one or more of the layers including a substrate of insulating material having circuit board means imbedded therein, the improvement including heat-conducting means positioned against at least one of the layers for removing heat from the arrangement, the heat-conducting means having an interior channel for transferring a fluid to accomplish the heat removal, and means providing electrical conduits through the heat-conducting means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.