Howard L. Davidson
82Patents
20h-index
55Co-inventors
91Inventor score
Filing activity: Jul 13, 1990 → Jun 2, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5320098A | Optical transdermal link | Emerging Cross-Sectional Technologies | 372 | Expired |
| US6239892A | Method and apparatus for bit synchronization in optical communication and networking systems | Electricity | 196 | Expired |
| US5880010A | Ultrathin electronics | Emerging Cross-Sectional Technologies | 145 | Expired |
| US5216580A | Optimized integral heat pipe and electronic circuit module arrangement | Electricity | 110 | Expired |
| US5065277A | Three dimensional packaging arrangement for computer systems and the like | Electricity | 93 | Expired |
| US5253702A | Integral heat pipe, heat exchanger, and clamping plate | Emerging Cross-Sectional Technologies | 84 | Expired |
| US5387259A | Optical transdermal linking method for transmitting power and a first data stream while receiving a second data stream | Emerging Cross-Sectional Technologies | 82 | Expired |
| US6718559B1 | Motorcycle helmut snap-on decorative device | Emerging Cross-Sectional Technologies | 67 | Expired |
| US5783316A | Composite material having high thermal conductivity and process for fabricating same | Emerging Cross-Sectional Technologies | 52 | Expired |
| US7372698B1 | Electronics equipment heat exchanger system | Electricity | 51 | Active |
| US5181167A | Stacking heatpipe for three dimensional electronic packaging | Mechanical Engineering; Lighting; Heating | 40 | Expired |
| US6400576B1 | Sub-package bypass capacitor mounting for an array packaged integrated circuit | Emerging Cross-Sectional Technologies | 39 | Expired |
| US5079619A | Apparatus for cooling compact arrays of electronic circuitry | Electricity | 35 | Expired |
| US5661450A | Low inductance termination resistor arrays | Emerging Cross-Sectional Technologies | 31 | Expired |
| US6166438A | Ultrathin electronics using stacked layers and interconnect vias | Emerging Cross-Sectional Technologies | 28 | Expired |
| US6870271B2 | Integrated circuit assembly module that supports capacitive communication between semiconductor dies | Electricity | 25 | Expired |
| US6888720B2 | Distributed graphitic foam heat exchanger system | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5053856A | Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices | Electricity | 21 | Expired |
| US8452182B2 | Data center with free-space optical communications | Electricity | 21 | Active |
| US5546274A | Three-dimensional compact array of electronic circuitry | Electricity | 20 | Expired |
| US6619858B1 | Optical interconnect | Physics | 20 | Expired |
| US6222122A | Sealed liquid-filled module and method of forming same | Electricity | 17 | Expired |
| US6279337A | Refrigeration system for electronic components having environmental isolation | Electricity | 16 | Expired |
| US6264882A | Process for fabricating composite material having high thermal conductivity | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6140141A | Method for cooling backside optically probed integrated circuits | Electricity | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.