Resilient mold assembly
US5059105A · kind A · utility
24Cited by
17References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 23, 1989 |
| Grant date | Oct 22, 1991 |
| Priority date | — |
| Expiry date | Oct 23, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/14336
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resilient sheet of material is used between a cavity plate and a mold base in a sytem used to encapsulate items such as semiconductor devices. The resilient sheet of material compensates for any dimensional variations in the cavity plates. In addition, compensation is also made for dimensional variations of the item being encapsulated. In one embodiment, the sheet of resilient material is used to seal cavity openings in the cavity plate. A method for the use of such an arrangement is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.