Laminated semiconductor sensor with overpressure protection
US5062302A · kind A · utility
54Cited by
22References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 1990 |
| Grant date | Nov 5, 1991 |
| Priority date | — |
| Expiry date | Aug 27, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S73/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electromechanical sensor is provided which comprises: first semiconductor wafer including a first stop surface residing in a first shallow recessed region of the first wafer; a second semiconductor wafer; wherein the first and second semiconductor wafers are laminated together such that the first recessed region of the first wafer and the second wafer define a first chamber in which the first stop surface and the second wafer are disposed close enough together such that the first stop surface restrains the second wafer from deflecting beyond the first stop surface; and an apparatus for measuring deflection of the second wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.