Method of packaging microwave semiconductor components and integrated circuits

US5063177A · kind A · utility

Assignee

• Comsat, Inc. · US

Inventors

• Bernard D. Geller · Durham, US
• Johann U. Tyler · Mount Airy, US
• Louis B. Holdeman · Boyds, US
• Fred R. Phelleps · Gaithersburg, US
• George F. Laird, III · Baltimore, US

Key dates

• Filing date: Oct 4, 1990
• Grant date: Nov 5, 1991
• Expiry date: Oct 4, 2010

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30111
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Integration and packaging of monolithic microwave integrated circuits (MMIC) components is facilitated by using a motherboard comprising high resistivity silicon, which having a thermal conductivity three times that of gallium arsenide. Ultra high purity, uncompensated silicon preferably is used. Anisotropic etching of recesses in the motherboard facilitates precise placement of the MMICs in the recesses, enabling use of automated die and wire bonding techniques to reduce required assembly time substantially. Using a silicon motherboard also ultimately enables incorporation of required control circuitry. The silicon motherboard also transmits RF energy well, a useful characteristic particularly in C-band and X-band applications in which microstrip is used, though other transmission media function well at even higher frequencies.