Fred R. Phelleps
2Patents
1h-index
9Co-inventors
33Inventor score
Filing activity: Oct 4, 1990 → Jan 27, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5063177A | Method of packaging microwave semiconductor components and integrated circuits | Electricity | 86 | Expired |
| US5683936A | Reactive ion etched assisted gold post process | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.