Carrier tape including molten resin flow path element for resin packaged semiconductor devices
US5064706A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1988 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Dec 8, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24322
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier tape includes a film having an opening for receiving a semiconductor chip to be resin-molded by a pair of mold halves and outer lead holes formed around the periphery of the opening, a plurality of leads for mounting the semiconductor chip on the film, and a resin running portion cooperating, when the mold halves are closed with the film held between the mold halves, with a gate formed on a parting surface of one of the mold halves to define a resin running path which extends from a portion of the film outside the outer lead holes to the opening for guiding a molten resin into the mold halves while preventing the resin from entering the outer lead holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.