Thermosetting polyimide schiff base resins, their preparation and their applications
US5064934A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1990 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Apr 2, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F38/00
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
Thermosetting Schiff base resins, their preparation and their applications re described. These thermosetting Schiff base resins can be defined as responding to the general formula: ##STR1## Radicals Ar.sub.1, Ar.sub.2 and Ar.sub.3 are chosen so that the softening temperature of the resins is less than about 150.degree. C. The resins can be prepared by direct condensation of an ethynyl benzaldehyde or acetophenone on a telechelic diamine oligomer obtained by reaction of a diamine containing flexibilizing groups on a derivative of benzhydrol tetracarboxylic acid. These Schiff base resins can be used by bulk thermal polymerization particularly to prepare adhesives or composite matrices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.