Integrated high-voltage bipolar power transistor and low voltage MOS power transistor structure in the emitter switching configuration and relative manufacturing process

US5065213A · kind A · utility

Assignee

• SGS-Thomson Microelectronics S.A. · IT

Inventors

• Ferruccio Frisina · Gravina di Catania, IT
• Giuseppe Ferla · Catania, IT

Key dates

• Filing date: Dec 21, 1988
• Grant date: Nov 12, 1991
• Expiry date: Dec 21, 2008

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S148/009

Abstract

A description is given of two versions of an integrated structure in the emitter switching configuration comprising a high-voltage bipolar power transistor an a low-voltage MOS power transistor. In the vertical MOS version, the emitter region of the bipolar transistor is completely buried, partly in a first N-epitaxial layer and partly in a second N epitaxial layer; the MOS is located above the emitter region. The bipolar is thus completely buried active sturcture. In the horizontal MOS version, in a N-epitaxial layer there are two P+regions, the first, which constitutes the base of the bipolar transistor, receives the N+emitter region of the same transistor; the second receives two N+regions which constitute the MOS source and drain regions, respectively; the front of the chip is provided with metal plating to ensure the connection between the MOS drain and the bipolar emitter contacts.