Molded integrated circuit package incorporating heat sink
US5065281A · kind A · utility
77Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1990 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Feb 12, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A molded integrated circuit package includes an integrated circuit chip, a heat sink device attached directly to the chip or lead frame and a molded package encapsulating the chip. The heat sink preferably comprises a thermally conductive material having a stem which communicates between the IC chip and the exterior of the molded package for direct conduction of heat from the IC chip to the exterior of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.