Solder placement nozzle with inert cover gas and inert gas bleed
US5065932A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1990 |
| Grant date | Nov 19, 1991 |
| Priority date | — |
| Expiry date | Sep 24, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes a nozzle head which has an interior bore for receiving an elongate heat source. The nozzle head also includes an orifice for receiving solid solder fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the inteiror bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad. A source of bleed gas is supplied to the interior of the assembly to protect the component parts and excluse oxygen from the interior of the assembly. A cover gas is also supplied to the solder site to reduce oxidation of the moltent solder and reduce the amount of flux required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.