Resistor under wirebond pad
US5066999A · kind A · utility
30Cited by
8References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 23, 1989 |
| Grant date | Nov 19, 1991 |
| Priority date | — |
| Expiry date | Oct 23, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/209
Abstract
A preferred embodiment of the invention is a poly input resistor located underneath, rather than alongside, an IC wirebond pad. This offers the advantages of a more efficient layout, more contacts connecting the pad to the resistor, a better contact configuration, and a larger, higher current resistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.