Process for preparing a combined wiring substrate
US5069745A · kind A · utility
3Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1990 |
| Grant date | Dec 3, 1991 |
| Priority date | — |
| Expiry date | Aug 24, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for preparing a combined wiring substrate is carried out by bonding with an adhesive agent the end surfaces of the mutually opposing sides of a plurality of substrates each having a pattern of wiring on its major surface, and by connecting electrically parts of the pattern of wiring which oppose each other by interposing the bonding portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.