Polyamide epoxy ester resin, process for preparation thereof and coating composition
US5070174A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 31, 1990 |
| Grant date | Dec 3, 1991 |
| Priority date | — |
| Expiry date | Dec 31, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G81/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed in a polyamide epoxy ester resin having a weight average molecular weight of 1,000 to 100,000, an epoxy equivalent of 500 to 10,000, and an acid value of not greater than 10, which is prepared by reacting PA1 (i) at least one epoxy resin which is a glycidyl ether of a dihydric phenol, PA1 (ii) at least one dihydric phenol and PA1 (iii) a polyamide dicarboxylic acid having an amine value of not greater than 20 and an acid value of at least 20, which is prepared by reacting a polymerized fatty acid composed mainly of a dimer acid with a diamine at a polymerized fatty acid/diamine molar ratio of from 2/1.0 to 2/1.9, at a ratio of such that the amount of the polyamide dicarboxylic acid segment in the resin ranges 1 to 30 percent by weight based on the weight of the resin. Also, disclosed are a process for preparing the polyamide epoxy ester resin and a coating composition comprising the resin. The coating composition is particularly useful for can coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.