Inventor · Tokyo, JP

Kaoru Ohba

12Patents
4h-index
22Co-inventors
60Inventor score

Filing activity: Dec 31, 1990 → Apr 27, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US5070174A Polyamide epoxy ester resin, process for preparation thereof and coating composition Chemistry; Metallurgy 10 Expired
US6420093B1 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards Electricity 6 Expired
US5223558A Process for preparation of high-molecular-weight epoxy dimer acid ester resin Chemistry; Metallurgy 5 Expired
US6670101B2 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards Electricity 5 Expired
US10487178B2 DMPA-based solvent systems for the synthesis of poly (amic acid) and polyimide polymers Chemistry; Metallurgy 1 Active
US10913058B2 Purification process for hydrolysable organic solvent Chemistry; Metallurgy 1 Active
US11581527B2 Ethyl cellulose as a dispersant for lithium ion battery cathode production Emerging Cross-Sectional Technologies 1 Active
US11016392B2 Amide combinations for cleaning and stripping of electronic parts Physics 0 Active
US11349115B2 Solvent systems for use in lithium ion battery production Emerging Cross-Sectional Technologies 0 Active
US10982047B2 Solvent systems for synthesis of poly(amic acid) and polyimide polymers Chemistry; Metallurgy 0 Active
US11759774B2 Purification process for hydrophilic organic solvent Chemistry; Metallurgy 0 Active
US10731114B2 Sulfoxide/glycol ether based solvents for use in the electronics industry Chemistry; Metallurgy 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.