Method of making an electrical multilayer interconnect
US5071518A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 24, 1989 |
| Grant date | Dec 10, 1991 |
| Priority date | — |
| Expiry date | Oct 24, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0733
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making an electrical multilayer interconnect in which the electrical lines can be protected by an overcoat. The method includes depositing an electrically conductive layer on a substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the plating mask, and stripping the electrically conductive layer below the stripped base plating mask. Additionally, a protective overcoat layer can be deposited on the exposed copper surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.